The global semiconductor manufacturing equipment market estimated to value over 66 billion by 2029 end and achieve CAGR of over 6.1% from 2019 to 2029. The convergence of the automotive industry and electronics is driving the growth of the market. The emergence of connected devices and IoT is representing an opportunistic space for end-users and manufacturers. The market is bifurcated into front end equipment, backend equipment, fab facility, dimension, and region. Based on front end equipment, lithography holds the majority share of the market. Substantial research in the field has influenced the market. Even though, it’s expensive front end equipment adds more value to the product. The availability of advanced and latest technologies have allowed the manufacturers to produce devices of high-quality. The expansion of automotive and consumer electronic devices has led to more semiconductor devices which in thus led to more demand for lithography. Based on backend equipment, bonding equipment is forecasted to witness notable growth. The growing to ensure efficient productivity and dependability is accelerating the demand for bonding equipment. Bonding equipment performs various functions such as surface cleaning, wafer bonding, and wafer alignment. Integrated device manufacturers give high importance to standardization; hence as a result, bonding equipment is forecasted to witness remarkable growth. In terms of fab facility, automation holds a vast market share. The growing automotive industry coupled with the inclusion of IoT and artificial intelligence remains the major factors responsible for the growing demand of semiconductors. Based on the dimension, the 3D segment is expected to grow substantially. The rapid demand for more advanced electronic products with higher performance and functionality is driving the growth of the market. Based on regions, North America is the global leader of the market. Multiple initiatives imposed by governments of the US is boosting the presence of the market. For instance, the National Science Foundation, National Institute of Standards and Technology are all investing heavily in R&D activity. Asia-Pacific region is projected to witness immense growth. The rising industrialization and urbanization in emerging economies are driving the market growth in the region. The growing demand for semiconductor devices in countries like Japan, China, and Taiwan is also positively influencing the market. The massive involvement of prominent players like Advantest Corporation, SCREEN Holdings Co.m Ltd and Tokyo Electron Limited is escalating the market. The incentives policy launched by the government on the chip industry which includes R&D sharing is positively influencing the market in the region. Prominent players of the market are Teradyne Inc, Hitachi High-Technologies Corporation, ASML Holding N.V, Advantest Corporation, Tokyo Electron, Rudolph Technologies, Inc., and Screen Holdings. Latest Mergers, acquisitions and product launches have also elevated the market. For instance, in 2017 ASML Holding NV acquired Hermes Microvision, Inc (Taiwan). The acquisition will further boost the products of ASML. In 2016, Applied Materials Inc. launched a new system, PROVision which is an insertion to its advanced e-beam system which inspects high-resolution image quality. PROVision is expected to perform 3 times faster. Global Semiconductor Manufacturing Equipment Market Segmentation: By Front-End Equipment Lithography DUV EUV Wafer Surface Conditioning Equipment Etching Chemical Mechanical Planarization Cleaning Process Single-Wafer Spray System Single-Wafer Cryogenic System Batch Immersion Cleaning System Batch Spray Cleaning System Scrubber Others By Back-End Back-End Processes Assembly and Packaging Dicing Equipment Bonding Equipment Metrology Equipment Test Equipment By Fab Facility Automation Chemical Control Equipment Gas Control Equipment Others By Dimension 2D 2.5D 3D By Region North America Europe Asia Pacific Latin America Rest of the World Competitive Landscape: ● Tier 1 players- established companies in the market with a major market share ● Tier 2 players ● Emerging players which are growing rapidly ● New Entrants FutureWise Key Takeaways ● Growth Prospects ● SWOT Analysis ● Key Trends ● Key data-points affecting market growth Objectives of the Study: To provide an exhaustive analysis of the global semiconductor manufacturing equipment market on the basis of front end equipment, back end equipment, fab facility, dimension and region To cater comprehensive information on factors impacting market growth (drivers, restraints, opportunities, and industry-specific restraints) To evaluate and forecast micro-markets and the overall market To predict the market size, in key regions (along with countries)—North America, Europe, Asia Pacific, Latin America, and the rest of the world To record evaluate and competitive landscape mapping- product launches, technological advancements, mergers and expansions Profiling of companies to evaluate their market shares, strategies, financials and core competencies Get unlimited analyst support and customise this study further to your requirements, contact sales@futurewiseresearch.com
The global semiconductor manufacturing equipment market estimated to value over 66 billion by 2029 end and achieve CAGR of over 6.1% from 2019 to 2029.
The convergence of the automotive industry and electronics is driving the growth of the market. The emergence of connected devices and IoT is representing an opportunistic space for end-users and manufacturers.
The market is bifurcated into front end equipment, backend equipment, fab facility, dimension, and region. Based on front end equipment, lithography holds the majority share of the market. Substantial research in the field has influenced the market. Even though, it’s expensive front end equipment adds more value to the product. The availability of advanced and latest technologies have allowed the manufacturers to produce devices of high-quality. The expansion of automotive and consumer electronic devices has led to more semiconductor devices which in thus led to more demand for lithography.
Based on backend equipment, bonding equipment is forecasted to witness notable growth. The growing to ensure efficient productivity and dependability is accelerating the demand for bonding equipment. Bonding equipment performs various functions such as surface cleaning, wafer bonding, and wafer alignment. Integrated device manufacturers give high importance to standardization; hence as a result, bonding equipment is forecasted to witness remarkable growth.
In terms of fab facility, automation holds a vast market share. The growing automotive industry coupled with the inclusion of IoT and artificial intelligence remains the major factors responsible for the growing demand of semiconductors.
Based on the dimension, the 3D segment is expected to grow substantially. The rapid demand for more advanced electronic products with higher performance and functionality is driving the growth of the market.
Based on regions, North America is the global leader of the market. Multiple initiatives imposed by governments of the US is boosting the presence of the market. For instance, the National Science Foundation, National Institute of Standards and Technology are all investing heavily in R&D activity. Asia-Pacific region is projected to witness immense growth. The rising industrialization and urbanization in emerging economies are driving the market growth in the region. The growing demand for semiconductor devices in countries like Japan, China, and Taiwan is also positively influencing the market. The massive involvement of prominent players like Advantest Corporation, SCREEN Holdings Co.m Ltd and Tokyo Electron Limited is escalating the market. The incentives policy launched by the government on the chip industry which includes R&D sharing is positively influencing the market in the region.
Prominent players of the market are Teradyne Inc, Hitachi High-Technologies Corporation, ASML Holding N.V, Advantest Corporation, Tokyo Electron, Rudolph Technologies, Inc., and Screen Holdings.
Latest Mergers, acquisitions and product launches have also elevated the market. For instance, in 2017 ASML Holding NV acquired Hermes Microvision, Inc (Taiwan). The acquisition will further boost the products of ASML. In 2016, Applied Materials Inc. launched a new system, PROVision which is an insertion to its advanced e-beam system which inspects high-resolution image quality. PROVision is expected to perform 3 times faster.
Global Semiconductor Manufacturing Equipment Market Segmentation:
By Front-End Equipment
By Back-End
By Fab Facility
By Dimension
By Region
Competitive Landscape:
● Tier 1 players- established companies in the market with a major market share
● Tier 2 players
● Emerging players which are growing rapidly
● New Entrants
FutureWise Key Takeaways
● Growth Prospects
● SWOT Analysis
● Key Trends
● Key data-points affecting market growth
Objectives of the Study:
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